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Nano-Silver

Technical Parameters

Note: according to user requirements of nano particle can provide different size products.

Product performance

        Silver powder has low ratios, good fluidity, Silver powder conductance layer surface smooth, conductivity, High-performance conductive filler material, have good oxidation stability. Widely used in electronic pastes, electronic products, electromagnetic shielding, conductive antibacterial antivirus.

Application direction

        1 Thin film, superfine fibers;

        2 Such as PVC, ABS, PC and plastic material, etc;

        3 Antibacterial agent;

        4 For high temperature sintering temperature and paste type electric conductive polymer silver pulp.

Storage conditions

        This product should be stored in dry, cool and sealing of the environment, can not be exposure to air, in addition should avoid the heavy pressure, according to ordinary goods transportation.

Sub-micron Silver

Technical Parameters

Note: according to user requirements of nano particle can provide different size products.

Product performance

        Sub-micron size, high dispersion, high conductivity, excellent sintered density.

Application direction

        Mainly suitable for high temperature sintering type of conductor through this series conductive fillers, can achieve the goal of different fabic combination of sintering and also can be used as catalyst, antibacterial materials for special purposes, Good oxidation stability. Widely used in electronic pastes, electronic products, electromagnetic shielding, conductive antibacterial antivirus.

Storage conditions

        This product should be stored in dry, cool and sealing of the environment, can not be exposure to air, in addition should avoid the heavy pressure, according to ordinary goods transportation.